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hlmp-cxxx t-13/4f(5fmm)fprecisionfopticalfperformance f inganfblue,fgreenfandfcyanflamps data sheet hlmp-cb15, hlmp-cb16, hlmp-cb30, hlmp-cb31, hlmp-cm15, hlmp-cm16, hlmp-cm30, hlmp-cm31, hlmp-ce15, hlmp-ce16, hlmp-ce23, hlmp-ce24, hlmp-ce30, hlmp-ce31 description these high intensity blue, green and cyan leds are based on ingan material technology. ingan is the most efcient and cost efective material for leds in the blue and green region of the spectrum. the 472 nm typical dominant wavelength for blue and 526 nm typical dominant wave - length for green are well suited to color mixing in full color signs. the 505 nm typical dominant wavelength matches international specifcations for green trafc signals. these led lamps are untinted, nondifused, t- 13/4 packages incorporating second generation optics which produce well defned spatial radiation patterns at specifc viewing cone angles. these lamps are made with an advanced optical grade epoxy, ofering superior high temperature and high moisture resistance perfor - mance in outdoor signal and sign applications. the high maximum led junction temperature limit of +130c enables high temperature operation in bright sunlight conditions. the package epoxy contains both uv-a and uv-b inhibitors to reduce the efects of long term exposure to direct sunlight. these lamps are available in two viewing angle for green and blue, and 3 viewing angles options for cyan to give the designer fexibility with optical design. features ? well defned spatial radiation pattern ? viewing angles: 15 , 23o and 30 ? high luminous output ? colors: 472 nm blue, 526 nm green, 505 nm cyan ? superior resistance to moisture ? uv resistant epoxy benefts ? superior performance in outdoor environments ? wavelengths suitable for color mixing in full color (rgb) signs applications ? commercial outdoor signs ? automotive interior lights ? front panel indicators ? front panel backlighting caution: hlmp-cbxx, hlmp-cmxx and hlmp-cexx leds are class 1c esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details.
device selection guide part number typical viewing angle 2 q 1/2 (deg) [1] color and typ. dominant wavelength d (nm) [2] luminous intensity, iv (mcd) at 20 ma [3,4,5] leads with stand-ofs package drawing min. max. hlmp-cb15-p00xxf 15f bluef47 f 880f - nof af hlmp-cb15-qt0xxf 15f bluef47 f 1150f 300f nof af hlmp-cb15-r00xxf 15f bluef47 f 1500f - nof af hlmp-cb15-rscxxf 15f bluef47 f 1500f 500f nof af hlmp-cb16-p00xxf 15f bluef47 f 880f - yesf bf hlmp-cb16-qt0xxf 15f bluef47 f 1150f 300f yesf bf hlmp-cm15-s00xxf 15f greenf5 6f 1900f - nof af hlmp-cm15-sv0xx 15f greenf5 6f 1900 5500 nof af hlmp-cm15-vy0xxf 15f greenf5 6f 400f 1000f nof af hlmp-cm15-w00xxf 15f greenf5 6f 5500f - nof af hlmp-cm15-wxbxxf 15f greenf5 6f 5500f 9300f nof af hlmp-cm15-wz0xx 15f greenf5 6f 5500 16000 nof af hlmp-cm16-s00xxf 15f greenf5 6f 1900f - yesf bf hlmp-cm16-vy0xxf 15f greenf5 6f 400f 1000f yesf bf hlmp-cm16-wygxx 15f greenf5 6f 5500 1000 yesf bf hlmp-ce15-vwcxx 15 cyanf505 400 700 no a hlmp-ce15-wzcxx 15 cyanf505 5500 16000 no a hlmp-ce15-wzqxx 15 cyanf505 5500 16000 no a hlmp-ce16-uxqxx 15 cyanf505 300 9300 yes b hlmp-ce16-wzbxx 15 cyanf505 5500 16000 yes b hlmp-ce16-wzcxx 15 cyanf505 5500 16000 yes b hlmp-ce16-wzqxx 15 cyanf505 5500 16000 yes b hlmp-ce 3-uvqxx f3 cyanf505 300 5500 no a hlmp-ce 3-uxcxx f3 cyanf505 300 9300 no a hlmp-ce 3-uxqxx f3 cyanf505 300 9300 no a hlmp-ce 3-vwcxx f3 cyanf505 400 700 no a hlmp-ce 3-vwqxx f3 cyanf505 400 700 no a hlmp-ce 3-vxqxx f3 cyanf505 400 9300 no a hlmp-ce 3-vycxx f3 cyanf505 400 1000 no a hlmp-ce 4-ux0xx f3 cyanf505 300 9300 yes b hlmp-ce 4-uxcxx f3 cyanf505 300 9300 yes b hlmp-ce 4-uxqxx f3 cyanf505 300 9300 yes b hlmp-ce 4-vxqxx f3 cyanf505 400 9300 yes b hlmp-ce 4-vycxx f3 cyanf505 400 1000 yes b hlmp-ce 4-vyqxx f3 cyanf505 400 1000 yes b
3 device selection guide (continued) part number typical viewing angle 2 q 1/2 (deg) [1] color and typ. dominant wavelength d (nm) [2] luminous intensity, iv (mcd) at 20 ma [3,4,5] leads with stand-ofs package drawing min. max. hlmp-cb30-k00xxf 30f bluef47 f 310f - nof af hlmp-cb30-m00xxf 30f bluef47 f 50f - nof af hlmp-cb30-npcxxf 30f bluef47 f 680f 1150f nof af hlmp-cb30-nrgxxf 30f bluef47 f 680f 1900f nof af hlmp-cb30-pqcxxf 30f bluef47 f 880f 1500f nof af hlmp-cb31-m00xxf 30f bluef47 f 50f - yesf bf hlmp-cb31-nrgxxf 30f bluef47 f 680f 1900f yesf bf hlmp-cb31-pqcxxf 30f bluef47 f 880f 1500f yesf bf hlmp-cm30-m00xxf 30f greenf5 6f 50f - nof af hlmp-cm30-rsbxxf 30f greenf5 6f 1500f 500f nof af hlmp-cm30-s00xxf 30f greenf5 6f 1900f - nof af hlmp-cm30-tucxxf 30f greenf5 6f 500f 400f nof af hlmp-cm30-tw0xxf 30f greenf5 6f 500f 700f nof af hlmp-cm30-twaxxf 30f greenf5 6f 500f 700f nof af hlmp-cm30-uvaxxf 30f greenf5 6f 300f 5500f nof af hlmp-cm30-uvcxx 30f greenf5 6f 300f 5500f nof af hlmp-cm31-m00xx 30f greenf5 6f 50 - yes b hlmp-cm31-s00xx 30f greenf5 6f 1900 - yes b hlmp-cm31-s0dxx 30f greenf5 6f 1900 - yes b hlmp-cm31-tucxx 30f greenf5 6f 500 400 yes b hlmp-cm31-tw0xx 30f greenf5 6f 500 700 yes b hlmp-cm31-twaxx 30f greenf5 6f 500 700 yes b hlmp-cm31-uvcxx 30f greenf5 6f 300 5500 yes b hlmp-cm31-vwcxx 30f greenf5 6f 400 700 yes b hlmp-ce30-rscxx 30 cyanf505 1500 500 no a hlmp-ce30-rucxx 30 cyanf505 1500 400 no a hlmp-ce30-stqxx 30 cyanf505 1900 300 no a hlmp-ce30-svcxx 30 cyanf505 1900 5500 no a hlmp-ce30-svqxx 30 cyanf505 1900 5500 no a hlmp-ce31-svcxx 30 cyanf505 1900 5500 yes b hlmp-ce31-svqxx 30 cyanf505 1900 5500 yes b notes: 1. q 1/2 is the of-axis angle where the luminous intensity is one half the on-axis intensity. 2. dominant wavelength, d, is derived from the cie chromaticity. diagram and represents the color of the lamp. 3. the luminous intensity is measured on the mechanical axis of the lamp package. 4. the optical axis is closely aligned with the package mechanical axis. 5. tolerance for each intensity bin limit is 15%.
4 part numbering system hlmp - x x xx - x x x xx mechanical options 00: bulk dd: ammo pack yy: flexi bin, bulk zz: flexi bin, ammo pack color bin selection 0: full color range a: color bin 1 & 2 only b: color bin 2 & 3 only c: color bin 3 & 4 only g: color bin 2, 3 & 4 only q: color bin 7 & 8 only maximum intensity bin 0: no maximum iv bin limit others: refer to intensity bin limit table minimum intensity bin refer to device selection guide viewing angle and standoff options 15: 15 degree without standoff 16: 15 degree with standoff 23: 23 degree without standoff 24: 23 degree with standoff 30: 30 degree without standoff 31: 30 degree with standoff color b: blue m: green e: cyan package c: t-1 3/4 (5 mm) round lam p
5 package dimensions package a package b hlmp-cx16 hlmp-cx24 hlmp-cx31 df=f1.6ff0.18f df=f1.40ff0.5f df=f1.ff0.50f (0.496ff0.007)f (0.488ff0.010)f (0.481ff0.00)f notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat d 1.50 0.15 (0.059 0.006)
6 absolute maximum ratings at t a = 25c parameter value units dcfforwardfcurrentf [1] 30f maf peakfforwardfcurrentf 100 maf powerfdissipation fffffblue fffffgreenf/fcyan 111 117 mwf reversefvoltagef(ir=f100fa)f 5f vf ledfjunctionftemperaturef 130 cf operatingftemperaturefrangef -40ftof+80f cf storageftemperaturefrangef -40ftof+100f cf note: 1. derate linearly as shown in figure 4 for temperatures above 50c. 2. duty factor 10%, 1khz electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions forwardfvoltagef fffffblue fffffgreenf/fcyan v f f f3.f f3. 3.7 3.9f fvf i f =f0fmaf reversefvoltagef v r 5f i r f=f100faf peakfwavelengthf fffffbluef(df=f47 fnm)f fffffgreenf(df=f5 6fnm)f fffffcyanf(df=f505fnm) l peak f470f f54f f50 fnmf peakfoffwavelengthfoff spectralfdistributionfatfi f f=f0fma spectralfhalfwidthf fffffbluef(df=f47 fnm)f fffffgreenf(df=f5 6fnm)f fffffcyanf(df=f505fnm) dl 1/ f35f f47f f35 fnmf wavelengthfwidthfatfspectralfpower pointfatfi f f=f0fmaf capacitancef fffffblue/fgreen fffffcyan cf f f43 f40f fpff v f f=f0,fff=f1fmhzf luminousfefcacyf fffffbluef(df=f47 fnm)f fffffgreenf(df=f5 6fnm)f fffffcyanf(df=f505fnm) vf f 75f f50f f350 flm/wf emittedfluminousfpower/emittedf radiantfpower thermalfresistancef r q j-pin f40f fc/wf ledfjunction-to-cathodefleadf notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 2. the radiant intensity, le in watts per steradian, may be found from the equation le = i v / h v , where iv is the luminous intensity in candelas and hv is the luminous efcacy in lumens/watt.
7 figure 1. relative intensity vs. wavelength. figure 2 : forward current vs. forward voltage. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. color vs. forward current 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity green blue cyan 0 5 10 15 20 25 30 35 0 0.5 1 1.5 2 2.5 3 3.5 4 forward voltage - v forward current - ma green/ cyan blue 0 1.5 0.5 intensity normalized at 20 ma i f - forward current - ma 30 1.0 10 25 20 0 5 15 i f - forward current - ma 0 0 t a - ambient temperature - o c 40 80 40 35 25 15 10 20 60 100 5 20 30 figure 6. spatial radiation pattern C 15 lamps. figure 8. spatial radiation pattern C 30 lamps. figure 7. spatial radiation pattern C 23 lamps. normalized intensity 0 angular displacement - degrees 0.8 0.6 0.2 -30 0.4 10 20 -20 -10 0 3 0 0.9 0.7 0.5 0.3 0.1 relative intensity 1.0 0 angle - degrees 0.5 -30 0 3 0 5 0 -50 10 -20 -10 20 -40 40 normalized intensity 0 angular displacement - degrees 0.8 0.6 0.2 -40 0.4 10 20 -20 -10 0 4 0 0.9 0.7 0.5 0.3 0.1 -30 30 0.990 0.995 1.000 1.005 1.010 1.015 1.020 1.025 1.030 0 5 10 15 20 25 30 35 dc forward current - ma relative dominant wavelength - nm blue cyan gree n
8 color bin limits (nm at 20 ma) blue color range (nm) bin id min. max. 1f 460.0f 464.0f f 464.0f 468.0f 3f 468.0f 47.0f 4f 47.0f 476.0f 5f 476.0f 480.0f tolerance for each bin limit is 0.5 nm. green color range (nm at 20ma) bin id min. max. 1f 50.0f 54.0f f 54.0f 58.0f 3f 58.0f 53.0f 4f 53.0f 536.0f 5f 536.0f 540.0f tolerance for each bin limit is 0.5 nm. cyan color range (nm) bin id min. max. 1f f 495f 500f 3f 500f 505f 4f 505f 510f 7f 498f 503f 8f 503f 508f tolerance for each bin limit is 0.5 nm intensity bin limits bin name min. max. kf 310f 400f lf 400f 50f mf 50f 680f nf 680f 880f pf 880f 1150f qf 1150f 1500f rf 1500f 1900f sf 1900f 500f tf 500f 300f uf 300f 400f vf 400f 5500f wf 5500f 700f xf 700f 9300f yf 9300f 1000f zf 1000f 16000f tolerance for each intensity bin limit is 15%. note: 1. all bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representatives for further information. relative light output vs. junction temperature 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 2 0 4 0 6 0 8 0 100 120 140 t j - junction temperature - c relative light output ( normalized at t j = oc) green blue cyan
9 avago technologies led confguration precautions: lead forming: ? the leads of an led lamp may be performed or cut to length prior to insertion and soldering on pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the led package. otherwise, cut the leads to applicable length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the led chip die attach and wirebond. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led closer than 1.59mm might damage the led. ? recommended soldering condition: wave soldering manual solder dipping pre-heatftemperature 105fcfmax. - preheatftime 30fsecfmax - peakftemperature 50fcfmax. 60fcfmax. dwellftime 3fsecfmax. 5fsecfmax ? wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. customer is advised to daily check on the soldering profle to ensure that the soldering profle is always conforming to recommended soldering condition. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250c. over-stressing the led during soldering process might cause premature failure to the led due to delamination. note: electrical connection between bottom surface of led die and the lead frame material through conductive paste of solder. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? at elevated temperature, the led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fxtures or pallet. ? special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. ? recommended pc board plated through holes size for led component leads. led component lead size diagonal plated through hole diameter 0.457fxf0.457fmm (0.018fxf0.018finch) 0.646fmm (0.05finch) 0.976ftof1.078fmm (0.038ftof0.04 finch) 0.508fxf0.508fmm (0.00fxf0.00finch) 0.718fmm (0.08finch) 1.049ftof1.150fmm (0.041ftof0.045finch) ? over sizing of plated through hole can lead to twisting or improper led placement during auto insertion. under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. note: refer to application note an1027 for more information on soldering led components. cathode 1.59mm
10 note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless standof or non-standof ammo packs drawing recommended wave soldering profle bottom sid e top side note: allow for boards to be conveyor speed = 1.83 m/min (6 ft/min ) 250 20 0 150 fluxing turbulent wave prehea t time - seconds temperature - c 10 0 50 30 0 10 20 30 40 50 60 70 80 90 10 0 laminar wave hot air knife lead free solder 96.5%sn; 3.0%ag; 0.5% c u sufficiently cooled before exerting mechanical force. of pc board of pc board preheat setting = 15 0 c (10 0 c pcb) solder wave temperature = 24 5 c 5?c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) solder: sn63; flux: rma air knife angle = 4 0 a a 12.701.00 0.500.0394 20.501.00 0.8070.039 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118 0.700.20 0.02760.0079 6.351.30 0.250.0512 ? 4.000.20typ. 0.15750.008 cathode view a-a
note: for ingan device, the ammo pack packaging box contain esd logo packaging box for ammo packs disclaimer avago technologies products and software are not specifically designed, manufactured or au - thorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. forfproductfinformationfandfafcompleteflistfoffdistributors,fpleasefgoftofourfwebfsite:fffffffff www.avagotech.com avago,favagoftechnologies,fandfthefaflogofareftrademarksfoffavagoftechnologies,flimitedfinfthefunitedfstatesfandfotherfcountries. datafsubjectftofchange.ffcopyrightf?f 007favagoftechnologiesflimited.fallfrightsfreserved.ff av0 -0 13enf-fmarchf1,f007

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